Stencil Thickness and Solder Paste Volume

Recommendations from Harwin Technical

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Stencil Recommendations

• Stencil thickness should be equal to the maximum coplanarity value of the connector tails.
• Stencil openings / apertures for solder application should be the same size as the recommended pad layout (see the applicable Technical Drawing/Datasheet).
• The solder paste used should be at least 80% solids by volume.
• The solder joints should be inspected in accordance to IPC-J-STD-001, and the process adjusted if necessary.
• Any parameters outside of this recommendation may require additional optimization of the soldering process, to achieve a satisfactory solder joint that meets the requirements of IPC-J-STD-001.

 

Solder Paste Volume

• Calculation of solder volume for basic rectangular pads = Pad width x Pad length x Stencil thickness.
• Solder volume for more complex shapes of pad can be calculated by finding the pad area, and multiplying by the stencil thickness.

 

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