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SMT Contact Pad
Surface Mount flat contact pad, rectangular shape. Gold finish.
3.8mm x 1.8mm rectangle, 0.1mm thick.
Use as a hard-wearing mating surface for SMT Spring Contacts or Spring Loaded Pogopins.
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Further Details
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Product Characteristics
Materials
Dimensions
Technical Documentation
Product Information
Environmental Compliance
Technical Details
Product Characteristics
Country of Origin:
TW
Number of Signal Contacts:
1
Operating Temperature:
-40°C to +180°C
RoHS Status:
RoHS Compliant (2015/863/EU) with no Exemption required
Current Rating:
6A
Soldering Data:
Max Solder Temperature: 260°C for 10 seconds
Polarised:
No
Cuttable:
No
Materials
Finish / Plating on Contact Surface:
Gold
Base Material of Contact:
Beryllium Copper
Packaging Style:
Tape and Reel
Finish / Plating on Termination:
Gold
Dimensions
Weight:
0.006g
Dimensions:
3.80 x 1.80 x 0.10
Height of Connector above PCB:
0.10mm
Downloads
Product Training Module - Overview of ATE Spring Probes and Miniature Spring Loaded Contacts (Pogo Pins)
Product Datasheet - POGOPINS: Pogo Pins and Contact Pads (EZi)
REACH - Harwin statement including all current SVHCs & Annex XIV & XVII
Conflict Minerals Reporting Template (CMRT) - Company Summary Statement
Extended Mineral Reporting Template (EMRT) - Company Summary Statement
Environmental Legislation Statement - includes all material legislations
Material composition for S70-138181045R product
RoHS - S70-138181045R
Product Information
Environmental Compliance
