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SMT Contact Pad
Surface Mount flat contact pad, rectangular shape. Gold finish.
2.5mm x 1.6mm rectangle, 0.15mm thick.
Use as a hard-wearing mating surface for SMT Spring Contacts, Spring Loaded Contacts and Spring Loaded Contact Assemblies.
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Further Details
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Product Characteristics
Materials
Dimensions
Product Information
Technical Documentation
Environmental Compliance
Technical Details
Product Characteristics
Country of Origin:
TW
Operating Temperature:
-40°C to +180°C
RoHS Status:
RoHS Compliant (2015/863/EU) with no Exemption required
Current Rating:
6A
Soldering Data:
Max Solder Temperature: 260°C for 10 seconds
Polarised:
No
Cuttable:
No
Materials
Finish / Plating on Contact Surface:
Gold
Base Material of Contact:
Beryllium Copper
Packaging Style:
Tape and Reel
Finish / Plating on Termination:
Gold
Dimensions
Weight:
0.006g
Dimensions:
2.50 x 1.60 x 0.15
Height of Connector above PCB:
0.15mm
Downloads
Product Datasheet - POGOPINS: Pogo Pins and Contact Pads (EZi)
Product Training Module - Overview of ATE Spring Probes and Miniature Spring Loaded Contacts (Pogo Pins)
Technical Drawing / Datasheet - S70-1XX.pdf
Outgassing data for Harwin products (plastics)
RoHS - S70-125161545R
Material composition for S70-125161545R product
REACH - Harwin statement including all current SVHCs & Annex XIV & XVII
Environmental Legislation Statement - includes all material legislations
Extended Mineral Reporting Template (EMRT) - Company Summary Statement
Conflict Minerals Reporting Template (CMRT) - Company Summary Statement
Product Information
Technical Documentation
Environmental Compliance
