We have not specifically tested this product with a pin-in-paste soldering method. In theory, the materials are compatible with this process – the plastic is similar to ones we use on SMT products, so will withstand the full heat exposure from a reflow oven process. However, you will need to consider that the underside of the connector is open, and there may be a risk of the liquid solder wicking up into the inside of the connector. You would need to test the process and see if it was compatible, or if you need to apply an additional solder mask tape or similar to the rear of the connector.