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Glossary

Definitions for jargon, scientific terms and phrases used at Harwin and across the connector and electronics industries.

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Wave Solder

The most common solder process used on Throughboard PCBs and devices. The devices are placed onto the PCB: their tails/leads hang through the board to the underside. These are placed onto a conveyor, which moves the PCB over a solder tank. The tank has a standing wave of hot liquid solder in it, so that the underside of the PCB and the leads pass through the top of this wave. The solder only sticks to where there is exposed metal (the tracks and the device leads), and does not stick to the rest of the PCB underside. Surface Tension in the solder creates a solder joint between the PCB track and the device lead, which then solidifies as the PCB passes out the machine and cools down.

WHMA

Wiring Harness Manufacturer’s Association®

Wire

See Cable

Wire-to-Board
Wireless

The transfer of information or power between two or more devices without any visible, physical conductor. Most common are radio waves, but can also include other electromagnetic wireless technologies, such as light, magnetic, or electric fields or the use of sound.

Typical applications include Bluetooth, cellular/mobile telephones, Wi-Fi, GPS, radio and broadcast television. Power transmission is one of the latest applications that is in the early stages of development.

Wiring Assembly
Wiring Harness
Wiring Loom
Withdrawal Force

The amount of force required to separate two mated contacts or connectors. This force does not include anything contributed by mechanical fixings - it is purely to overcome the spring forces keeping the connection point mated. This force is normally quoted in specifications as being a minimum force requirement, but may also have a maximum. It is sometimes also referred to as Holding Force.