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This highly efficient plating facility is an integral part of the company's manufacturing unit. In order to keep pace with increased production a substantial investment in the plating process has taken place over the last few years.
Developments within the plating facility have allowed for a number of innovative techniques to be adopted to improve the selective plating process, making it possible to achieve accuracy of the plating position to 0.2mm and better. Chemical control can now be achieved by the use of X-ray fluorescence for solution analysis giving greater accuracy and faster results. Other quality assurance methods used include atomic absorption, artificial ageing and solderability testing. These methods, together with micro section facilities, ensure optimum plating conditions that guarantee your electro-plating specifications.